Process Services

Leading edge process engineering

Process Services

 

Process

Nanopatterning

State-of-the-art nanopatterning capabilities using electron beam direct write lithography and reactive ion etching.

 

Process

Atomic Layer Deposition (ALD)

Leading edge high-k technologies for 300 mm (12in) and smaller wafer sizes.

 

Process

Chemical Mechanical Planarization (CMP)

CMP processes development for new materials to fulfill the demands of the next gen technology nodes.

 

Process

Wafer Plating

ECD process development for galvanic deposition of metal layers through electrolyte screening, bath life time investigation and process characterization.

 

Process

Wafer Cleaning

Screening and optimization of new chemicals and processes from laboratory scale up to 2x nm node test wafer evaluation.