Leading edge process engineering
Where am I?
State-of-the-art nanopatterning capabilities using electron beam direct write lithography and reactive ion etching.
Leading edge high-k technologies for 300 mm (12in) and smaller wafer sizes.
CMP processes development for new materials to fulfill the demands of the next gen technology nodes.
ECD process development for galvanic deposition of metal layers through electrolyte screening, bath life time investigation and process characterization.
Screening and optimization of new chemicals and processes from laboratory scale up to 2x nm node test wafer evaluation.